World’s smallest ultrasound system-on-chip sampling to smartphone makers: 1.4 x 2.4x 0.49 mm (about the size of the tip of a pen), production-ready in December, available in smartphones in 2020
Opens new design possibilities for virtual buttons in smartphones, cars, IoT, medical and home appliances to create sleek designs and dedicated touch experiences for specific tasks
Immune to sensing through moisture, dirt, oils and lotions,enabling touch through any material and thickness: metal, glass, wood, ceramic and plastic
San Jose, CA. (December 17, 2019) – Today a new company, UltraSense Systems, emerged from stealth mode to usher in a paradigm shift for touch user interfaces. UltraSense’s unique technology can now enable a multi-functional touch interface to be done through virtually any material and any material thickness,including metal, glass, wood, ceramic and plastic, to cost-effectively turn any surface into a virtual button or gesture. With its unveiling, the company introduced its family of TouchPoint ultrasound sensors, which are already sampling and is expected to be incorporated into several consumer devices in 2020.
UltraSense was founded by a team of experts with experience in manufacturing and selling over one billion motion and audio sensors to the smartphone and consumer electronics markets
“We have seen a shift in the way we interact with our devices, where digital has replaced mechanical, and the move to virtual buttons and surface gestures is accelerating,” said Mo Maghsoudnia,founder and CEO, UltraSense Systems.“The use of ultrasound in touch user interfaces has not been implemented in such a novel way until now. Our family of TouchPoint ultrasound sensor solutions enable new use cases that allow OEMs to bring a differentiated user experience with a wider variety of touch and gesture functions under virtually any material and material thickness.”
“The UltraSense TouchPoint ultrasound sensor is a unique and innovative addition to the list of solutions for user interface capabilities,” said Richard Wawrzyniak, principal market analyst for ASIC &SoC at Semico Research. “This gives industrial designers a really useful option to differentiate their products while improving performance without adding to clutter. Needless to say, the ‘cool’ factor in products that employ this technology is going to be very high. Semico thinks this product is going to very successful as designers discover what they can do with it.”